UMCIE Secures $220

Meet Mee Kitchen

Meet Mee Kitchen Sdn Bhd (“Meet Mee”) was established in 2016 with its first Pan Mee restaurant in Setapak, Kuala Lumpur. When the pandemic hit in 2020, Meet Mee strategically closed its six physical stores and pivoted to e-commerce, launching its instant Pan Mee, which received an overwhelmingly positive response in the market and has been in high demand ever since. Meet Mee is the first producer of Halal-certified instant Chili Pan Mee in Malaysia. Meet Mee has sold over 4 million packets of instant Pan Mee within 3 years and has been recognized by the Malaysia Book of Records for selling the most instant Pan Mee by a brand in one hour (42,601 packets sold). Meet Mee proudly stands as Malaysia’s premier instant Pan Mee brand, offering a delicious, authentic, and convenient culinary experience to consumers nationwide. With a commitment to quality, innovation and authentic flavors, Meet Mee has earned the reputation as the go-to choice for discerning Pan Mee enthusiasts.

FirstChip Sdn. Bhd.

We are a team of Monash engineers passionate about creating engaging, real-world products that blend fun with engineering excellence.

Silicon X Sdn Bhd

Silicon X is a chip product company specializing in low-latency, low power, and cost-effective FPGA solutions.

nanoSkunkWorkX

nanoSkunkWorkX | nSWX develops process-level interface devices for systems limited by heat, current, charge transfer, and signal transduction. Our first commercial wedge is nSD-I — nanostructured Scalable Device - Interconnect — a patternable, Cu-compatible conductor interface for AI advanced packaging. nSD-I is designed to improve package-level copper routing without replacing copper, front-end dual damascene, or the customer’s capital-equipment stack. The first insertion lanes are RDL, interposer, bridge-adjacent, and high-current Cu structures. The objective is simple: make copper work harder inside existing package architectures. nSD-I is built on SUSANNE, nSWX’s zero-vacuum, low CapEx/OpEx electrochemical interface-engineering platform. SUSANNE enables controlled interface formation across substrates and applications, with expansion paths into hydrogen electrodes and field diagnostics through nSD-H and nSD-bio. nSWX is not a commodity materials supplier, coating vendor, or capital-equipment company. We develop qualified process steps that can be embedded into partner manufacturing flows. Current focus: convert measured nSD-I Cu-enhancement into qualification-grade RDL / interposer package evidence. Core areas: • AI advanced packaging • Cu-compatible conductor interfaces • RDL / interposer / high-current Cu structures • Electrochemical interface engineering • Hydrogen electrode interfaces • Field diagnostics and bioelectronic transduction nSD-I is the wedge. SUSANNE is the platform.

NSW Automation Sdn Bhd

NSW Automation is a leading global company that specializes in precision liquid dispensing systems in today’s global microelectronics and semiconductors industries. We are Malaysian based and headquartered in Penang. Our clients vary from manufacturers of electronic components to semiconductors, SMD LED, military, automotive, medical (biotech), and aerospace industries. We have global footprints with multiple factories, sales & service offices, and technical support points in the USA, China, Taiwan, South Korea, Southeast Asian countries, Germany, UK, Russia, Switzerland, and many more. Our seamless Digital-Programmable Volumetric Dispensing and Micro-volume Squeezing Technology have already created a significant breakthrough in the automated liquid dispensing system market. Our equipment has managed to move the milestone of today’s volumetric dispenser market. We are currently pursuing Industry 4.0 cloud-based standards in our automated fluid dispensing systems. It perfects the mechanization of Industry 3.0, where smarter and autonomous systems fuelled by data and machine learning is optimized. Our machinery would be able to handle IoT (Internet of Things) as we transcend the era of productivity.