PolicyStreet Raises $5.0M Series C Funding

Universiti Malaya Center of Innovation and Enterprise (UMCIE)

Universiti Malaya Centre of Innovation & Enterprise (UMCIE) is the technology transfer office (TTO) for University of Malaya. UMCIC is responsible for managing the university’s intellectual property and technology transfer activities. We welcome partners in exploring technology development and licensing opportunities in technology domains ranging from Engineering, Life Sciences, Medical, ICT, Digital Tech, Green Tech as well as a wide variety of services we are traditionally renowned for. Find out about the excellent facilities accessible to industry and our new UMXcelerate program, UMX launchpads, wet and dry labs and innovation support all aim to foster innovation transfer in a wide range of fields, along with premium space available for tech start-up partners in our incubator. Our integrated and research-centric approach to technology development comprises: Collaboration - Industry, Investor & Inventor; Intellectual property management & legal advice; Technology commercialization through venture creation and licensing; Technology accelerator programme; Business Pods & Startups creation.

Silicon X Sdn Bhd

Silicon X is a chip product company specializing in low-latency, low power, and cost-effective FPGA solutions.

nanoSkunkWorkX

nanoSkunkWorkX | nSWX develops process-level interface devices for systems limited by heat, current, charge transfer, and signal transduction. Our first commercial wedge is nSD-I — nanostructured Scalable Device - Interconnect — a patternable, Cu-compatible conductor interface for AI advanced packaging. nSD-I is designed to improve package-level copper routing without replacing copper, front-end dual damascene, or the customer’s capital-equipment stack. The first insertion lanes are RDL, interposer, bridge-adjacent, and high-current Cu structures. The objective is simple: make copper work harder inside existing package architectures. nSD-I is built on SUSANNE, nSWX’s zero-vacuum, low CapEx/OpEx electrochemical interface-engineering platform. SUSANNE enables controlled interface formation across substrates and applications, with expansion paths into hydrogen electrodes and field diagnostics through nSD-H and nSD-bio. nSWX is not a commodity materials supplier, coating vendor, or capital-equipment company. We develop qualified process steps that can be embedded into partner manufacturing flows. Current focus: convert measured nSD-I Cu-enhancement into qualification-grade RDL / interposer package evidence. Core areas: • AI advanced packaging • Cu-compatible conductor interfaces • RDL / interposer / high-current Cu structures • Electrochemical interface engineering • Hydrogen electrode interfaces • Field diagnostics and bioelectronic transduction nSD-I is the wedge. SUSANNE is the platform.