NSW Automation Sdn Bhd Raises $220K

Meet Mee Kitchen

Meet Mee Kitchen Sdn Bhd (“Meet Mee”) was established in 2016 with its first Pan Mee restaurant in Setapak, Kuala Lumpur. When the pandemic hit in 2020, Meet Mee strategically closed its six physical stores and pivoted to e-commerce, launching its instant Pan Mee, which received an overwhelmingly positive response in the market and has been in high demand ever since. Meet Mee is the first producer of Halal-certified instant Chili Pan Mee in Malaysia. Meet Mee has sold over 4 million packets of instant Pan Mee within 3 years and has been recognized by the Malaysia Book of Records for selling the most instant Pan Mee by a brand in one hour (42,601 packets sold). Meet Mee proudly stands as Malaysia’s premier instant Pan Mee brand, offering a delicious, authentic, and convenient culinary experience to consumers nationwide. With a commitment to quality, innovation and authentic flavors, Meet Mee has earned the reputation as the go-to choice for discerning Pan Mee enthusiasts.

FirstChip Sdn. Bhd.

We are a team of Monash engineers passionate about creating engaging, real-world products that blend fun with engineering excellence.

Universiti Malaya Center of Innovation and Enterprise (UMCIE)

Universiti Malaya Centre of Innovation & Enterprise (UMCIE) is the technology transfer office (TTO) for University of Malaya. UMCIC is responsible for managing the university’s intellectual property and technology transfer activities. We welcome partners in exploring technology development and licensing opportunities in technology domains ranging from Engineering, Life Sciences, Medical, ICT, Digital Tech, Green Tech as well as a wide variety of services we are traditionally renowned for. Find out about the excellent facilities accessible to industry and our new UMXcelerate program, UMX launchpads, wet and dry labs and innovation support all aim to foster innovation transfer in a wide range of fields, along with premium space available for tech start-up partners in our incubator. Our integrated and research-centric approach to technology development comprises: Collaboration - Industry, Investor & Inventor; Intellectual property management & legal advice; Technology commercialization through venture creation and licensing; Technology accelerator programme; Business Pods & Startups creation.

Silicon X Sdn Bhd

Silicon X is a chip product company specializing in low-latency, low power, and cost-effective FPGA solutions.

nanoSkunkWorkX

nanoSkunkWorkX | nSWX develops process-level interface devices for systems limited by heat, current, charge transfer, and signal transduction. Our first commercial wedge is nSD-I — nanostructured Scalable Device - Interconnect — a patternable, Cu-compatible conductor interface for AI advanced packaging. nSD-I is designed to improve package-level copper routing without replacing copper, front-end dual damascene, or the customer’s capital-equipment stack. The first insertion lanes are RDL, interposer, bridge-adjacent, and high-current Cu structures. The objective is simple: make copper work harder inside existing package architectures. nSD-I is built on SUSANNE, nSWX’s zero-vacuum, low CapEx/OpEx electrochemical interface-engineering platform. SUSANNE enables controlled interface formation across substrates and applications, with expansion paths into hydrogen electrodes and field diagnostics through nSD-H and nSD-bio. nSWX is not a commodity materials supplier, coating vendor, or capital-equipment company. We develop qualified process steps that can be embedded into partner manufacturing flows. Current focus: convert measured nSD-I Cu-enhancement into qualification-grade RDL / interposer package evidence. Core areas: • AI advanced packaging • Cu-compatible conductor interfaces • RDL / interposer / high-current Cu structures • Electrochemical interface engineering • Hydrogen electrode interfaces • Field diagnostics and bioelectronic transduction nSD-I is the wedge. SUSANNE is the platform.