The race to build faster, more efficient photonic systems just got a boost, with Lightspring announcing it has closed a $3.6M seed funding round. The startup is focused on creating the foundational optical interconnects necessary for next-generation chip-chip and fiber-chip coupling, utilizing high-performance 3D-lithography.
This fresh capital, backed by investors like Atlantic, OVNI Capital, Concept Ventures, IXCORE GROUP, and Plug and Play Ventures, will fuel Lightspring's mission to develop the critical backbone for advanced computing and communication infrastructure.















